System & Advanced Packaging Design Lead
Phizenix · Santa Clara, CA (Hybrid)
Description (excerpt)
Role Overview We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers Key Responsibilities Technical Leadership & Execution Own package, PCB, and system-level signal …
Description excerpt. See the original posting for full details.
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